This two-component epoxy resin encapsulant can be cured either at room temperature or under heat; upon curing, it forms a rigid resin matrix that provides effective protection and sealing for electronic components. The curing process is gentle and releases less heat compared to conventional epoxy resins, making it easy to handle and featuring a very low shrinkage rate. Special organic additives enhance the compound's leveling and degassing properties, enabling it to fill even the smallest gaps, while the cured product exhibits a bright, smooth surface finish.
Product Number: XMC-5353A/B；XMC-5355A/B
English
Français
Tiếng Việt
