Two parts potting sealant 5:1 XMC4010

Shanghai XMC New Material Technology Co., Ltd.

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Overview
Properties
Technical Content

Product Overview
The Two-Component Potting Compound (5:1) is a dual-component encapsulation material developed for electronic, electrical, and industrial component protection. After mixing at a 5:1 ratio, the compound forms a durable protective layer with reliable insulation, environmental resistance, and mechanical stability.
The product is compatible with different dispensing and potting processes, helping protect sensitive components from moisture, dust, vibration, and external environmental exposure.

Product Features

Reliable Mechanical Protection

Forms a stable encapsulation layer after curing
Enhances vibration and impact resistance
Reduces environmental influence on components

Excellent Electrical Insulation

Stable dielectric properties
Improves operational safety of electronic systems
Suitable for various electrical encapsulation applications

Stable Moisture and Heat Resistance

Maintains performance in humid environments
Helps reduce moisture penetration
Supports long-term operational reliability

Suitable for Automated Production

Compatible with automated dispensing equipment
Improves production efficiency
Suitable for mass manufacturing processes

Good Material Compatibility

Compatible with common electronic materials
Suitable for multiple substrate applications

Applications
Power Module Encapsulation: Used for switching power supplies and power conversion modules.
LED Electronic Assemblies: Suitable for LED controllers, drivers, and lighting components.
Industrial Control Systems: Applied in industrial control boards, relays, and automation modules.
Electrical Connectors: Used for terminal blocks, connectors, and wiring assemblies.
New Energy Equipment: Suitable for energy storage systems and new energy electronic devices.