Product Overview
The Two-Component Potting Compound (6:1) is a high-performance encapsulation material formulated with a resin and curing agent mixed at a 6:1 ratio. It is designed for the sealing and protection of electronic components, power modules, LED drivers, electrical connectors, and industrial control assemblies.
After curing, the material forms a stable protective layer with excellent insulation, moisture resistance, and environmental durability. Its balanced viscosity and flow characteristics make it suitable for both manual and automated dispensing processes.
Product Features
Excellent Electrical Insulation
Good Flowability
Reliable Weather Resistance
Strong Adhesion
Adjustable Curing Performance
Applications
Electronic Component Encapsulation: Used for PCB assemblies, sensors, and electronic modules.
LED Drivers and Power Supplies: Suitable for LED driver encapsulation and lighting control modules.
Industrial Electrical Equipment: Applied in relays, controllers, power modules, and automation systems.
Communication Devices: Used for cable connectors, communication interfaces, and signal modules.
New Energy Electronic Components: Suitable for battery systems, energy storage equipment, and control units.
Storage and Handling
Store in a cool and dry environment
Stir thoroughly before use
Mix accurately according to the specified ratio
Prevent contamination from moisture or impurities
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