Product Features:
The epoxy potting compound release agent is applied to the mold surface, where its active ingredients form a dense film. This film is resistant to high pressure and erosion during the injection molding process, effectively preventing the bonded adhesion between the molded part material and the mold, thereby providing an effective release barrier. The mold temperature can be maintained consistently between-50°C and 280°C; the mold will not develop cracks or delamination due to thermal expansion or contraction. The release agent forms a uniform film without any accumulation, resulting in a bright, colorless surface finish on the molded part. It exhibits excellent adhesion to high-temperature surfaces and can be used even when the mold temperature reaches up to 280°C. The product is non-toxic, non-flammable, non-corrosive, and does not undergo any chemical reactions; it does not emit harmful smoke during use. It is suitable for providing release during the molding of epoxy resins, FRP resins, silicone, rubber, plastics, polyurethane foam, and other materials.
Product Code: XMC-5010/XMC-5120
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